Product Engineer, Silicon

• Perform SoC Artificial Intelligence (AI)-centric product specifications and Design for testing (DFT) architecture reviews and generate New Product Introduction (NPI) characterization, test, or manufacturing plans.

• Support test hardware design (e.g., probe card, Load board) requirements, ATE/SLT test program review, and work for test coverage.

• Perform Die/Package level bring-ups, troubleshoot different failure modes and help resolve issues by collaborating with cross-functional teams.

• Support Outsourced Assembly and Test (OSAT) bring-up, ATE/SLT manufacturing test programs releases, and meet test cost goals.

• Manage NPI and Manufacturing Return Materials/Merchandise Authorizations (RMAs) to achieve TurnAround Times (TATs) and provide lot dispositions.

Minimum qualifications:

• Bachelor's degree in Electrical Engineering, Semiconductor Processing, or a related field, or equivalent practical experience.

• 4 years of experience in VLSI technologies, product and test engineering, and semiconductor processing.

• Experience in Integrated Circuit (IC) qualification, data review, production release, system level testing, test time reduction and yield improvement.

• Experience with Yield and Fail Pareto Analysis using JMP, Exensio, Datapower or O+.

Preferred qualifications:

• 8 years of experience in VLSI technologies, Product and Test Engineering, Semiconductor processing.

• Experience in Test and Design for test (DFT) techniques, and with structural tests such as Scan/ATPG, JTAG, Memory BIST and sensors such as PVT/temperature/current/droop sensors, etc.

• Experience with test chip design, development and testing methodologies.

• Experience with advanced packaging such as 2.5d, 3d, InFo.

• Familiar with Automatic Test Equipment (ATE) test platforms such as Advantest 93K , Teradyne UltraFlex SOC test system.

• Knowledge of reliability stress, device qualification and associated processes.