
Senior Signal and Power Integrity Engineer, Pixel
職缺摘要
技術需求
學歷要求
Bachelor
職缺描述
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Design Google's future products by managing architecture selection, electrical design, and validation, including early product architecture definition and manage Signal Integrity (SI) and Power Integrity (PI) of products and sub-component development.
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Provide detailed SI/PI rules for cutting-edge PCB and Flex technology and participate in PCB design reviews and drive resolution of SI/PI challenges in collaboration with Design Engineer, PCB Designer, and System teams.
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Provide simulation and DOEs to support cross-functional teams on SI/PI debugging, root-cause analysis, and solution optimization and work with Engineering/Qualification teams on system bring-up and design validation.
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Bring Pixel design to mass production by defining ERS, analyzing test data, assisting in software bring-up, and traveling on-site to ensure successful manufacturing and testing.
Minimum qualifications:
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Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field or equivalent practical experience.
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4 years of work experience in Consumer Electronics/embedded system design or electrical systems development.
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4 years of experience with signal and power integrity simulation of system boards, including SoC/chipset, Memory technology, and other communication interfaces.
Preferred qualifications:
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MS degree or PhD in Electrical Engineering or Computer Engineering.
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8 years of working experience with implementing a product development process for mass volume production design, with a focus on signal integrity, power integrity and electromagnetic interference (EMI).
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Experience with managing SIPI trade-off decisions with cross functional teams to define an optimized solution that meets product design requirements.
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Experience with industry SIPI simulation and lab tools (e.g. Ansys HFSS, SIwave, Designer, Cadence Sigrity tools, ADS, Hspice, TDR, VNA).
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Strong fundamental understanding of hardware system architecture, spanning SOC, PMIC, Audio, sensors, display, touch, camera and/or RF subsystems.