Senior Signal and Power Integrity Engineer, Pixel

• Design Google's future products by managing architecture selection, electrical design, and validation, including early product architecture definition and manage Signal Integrity (SI) and Power Integrity (PI) of products and sub-component development.

• Provide detailed SI/PI rules for cutting-edge PCB and Flex technology and participate in PCB design reviews and drive resolution of SI/PI challenges in collaboration with Design Engineer, PCB Designer, and System teams.

• Provide simulation and DOEs to support cross-functional teams on SI/PI debugging, root-cause analysis, and solution optimization and work with Engineering/Qualification teams on system bring-up and design validation.

• Bring Pixel design to mass production by defining ERS, analyzing test data, assisting in software bring-up, and traveling on-site to ensure successful manufacturing and testing.

Minimum qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field or equivalent practical experience.

• 4 years of work experience in Consumer Electronics/embedded system design or electrical systems development.

• 4 years of experience with signal and power integrity simulation of system boards, including SoC/chipset, Memory technology, and other communication interfaces.

Preferred qualifications:

• MS degree or PhD in Electrical Engineering or Computer Engineering.

• 8 years of working experience with implementing a product development process for mass volume production design, with a focus on signal integrity, power integrity and electromagnetic interference (EMI).

• Experience with managing SIPI trade-off decisions with cross functional teams to define an optimized solution that meets product design requirements.

• Experience with industry SIPI simulation and lab tools (e.g. Ansys HFSS, SIwave, Designer, Cadence Sigrity tools, ADS, Hspice, TDR, VNA).

• Strong fundamental understanding of hardware system architecture, spanning SOC, PMIC, Audio, sensors, display, touch, camera and/or RF subsystems.