Principal/ Staff Engineer, Advanced Packaging Process Integration

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

 

 

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.   

 

As the Principal/ Staff Engineer, Advanced Packaging Process Integration, be part of an exciting team working on cutting-edge advanced packaging process technologies. To drive the development and validation of module process and integration the solutions to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our partners taking them from concept to mass production. Responsibilities will include advanced packaging process integration development, program management, execute gap-analysis, risk-assessment and mitigation, and monitor and track integration process flow development to make sure integration projects are completed successfully and delivered on time. This position is based in Singapore.

Key Responsibilities

Process Development:

• Lead the development and optimization of advanced packaging processes such as 2.5D/3D IC packaging, wafer-level packaging, and other emerging technologies.
• Collaborate with R&D teams to design and implement new packaging techniques.

Project Management:

• Manage projects from conception through to production, ensuring timelines and budgets are met.
• Coordinate cross-functional teams to achieve project objectives.

Technical Leadership:

• Provide technical guidance and mentorship to the engineering team.
• Stay updated with the latest advancements in semiconductor packaging and integrate them into the company's processes.

Quality Assurance:

• Ensure that all packaging processes meet the required quality standards and industry regulations.
• Implement and monitor process control systems to ensure high yield and reliability.

Collaboration and Communication:

• Work closely with design, manufacturing, and supply chain teams to ensure seamless integration of packaging solutions.
• Communicate effectively with stakeholders, including customers and senior management, to provide updates and gather requirements.

Problem Solving:

• Identify and resolve technical issues related to packaging processes.
• Conduct root cause analysis and implement corrective actions.

Requirements

Education:

• A bachelor's degree in engineering, materials science, physics, or a related field is typically required. An advanced degree (Master's or Ph.D.) is often preferred.

Experience:

• Extensive experience in semiconductor process integration, with a focus on advanced packaging technologies.
• Proven track record of managing complex projects and leading engineering teams.

Skills:

• Strong understanding of semiconductor fabrication and packaging processes.
• Excellent project management and leadership skills.
• Proficient in data analysis and problem-solving techniques.
• Strong communication and interpersonal skills.

Knowledge:

• Familiarity with industry standards and regulatory requirements for semiconductor packaging.
• Up-to-date knowledge of emerging trends and technologies in semiconductor packaging.

Work Location:

• Science Park II (Moving to Tampines in end 2026)

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.