<2026 Internship Program> Process Engineer Intern (Wire Bonding)

高雄實習不限實習生發布：2026-06-04

職缺摘要

•職責：確保生產順利運行、協助系統監控確認、配合工程師進行製程良率改善

•領域：Wire Bonding 製程、電漿清潔、晶片連接製程工程

•技能：電漿清潔原理、Wire Bonding Integrity、晶片結構、MS Office、程式設計

•亮點：適合材料、科學、電子工程相關科系學生的 Wire Bonding 製程實習機會

Plasma cleaningWire BondingChip die padLead-post structuresMS OfficeProgramming

Bachelor

To work with operation/maintenance to ensure production smoothly.
To assist action confirmations with system monitors.
To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.

Job Qualification:

Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures
Bachelor's or Master's student in Material/Science/Electronic Engineering or related
Available to work at least 3 days/week.
Good verbal and written English communication skills
MS Office or Programming skill
Self-motivated, results oriented, willing and eager to learn, proactive attitude

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