職缺青蛙

• 職責：NXP 倉儲作業員，負責倉庫日常作業（具體內容依實際公告為準） • 領域：半導體 / 倉儲物流 • 技能：倉庫作業、物料管理 • 亮點：加入 NXP 台灣供應鏈團隊，參與全球半導體領導廠商物流運作

• 職責：NXP 封裝工程主管，主導組裝製程整合風險評估、新材料/供應商評估，建立第二供應策略 • 領域：半導體先進封裝 / 組裝製程整合 • 技能：封裝製程整合、風險評估、供應商開發、設備 benchmarking、材料評估 • 亮點：15 年以上封裝資歷，以整合者角色主導從晶圓到成品全程製程最佳化

• 職責：NXP 製造測試工程師（新鮮人友善），負責系統與硬體測試、效率改善專案，維護技術文件 • 領域：半導體製造測試 / 系統硬體 • 技能：電子電路、半導體基礎、C/C++/Python、測試程式 debug、技術文件 • 亮點：新鮮人可申請，進入 NXP 測試工程核心，兼顧系統與硬體面向

• 職責：NXP 失效分析硬體驗證工程師，驗證電性測試硬體準確性與可靠性，確保測試圖案與板設計符合標準 • 領域：半導體失效分析 / 測試硬體驗證 • 技能：電性測試硬體驗證、測試圖案驗證、故障排除、文件報告、跨部門協作 • 亮點：確保 NXP FA 測試硬體品質，支援產品分析與成功釋出

• 職責：NXP 失效分析軟體開發工程師，開發 FA/Reliability 實驗室數據收集與軟體工具，支援 CAD 導覽與記憶體 bitmap • 領域：半導體失效分析 / 軟體工具開發 • 技能：Python/Perl/Tcl/Shell、半導體設計工具（Cadence/Mentor）、軟體工具開發 • 亮點：以軟體工具賦能 NXP FA 與可靠性團隊，提升分析效率

Your responsibilities Test Engineer who work for Test program development, maintenance, debugging, test development and test cost reduction for new product creation and industrialization, production fulfillment, and custome return handling to ensure Business Lines business success and fullfill customer requirement. Develop test program per differnt IP domain for Radar Chips. Support root cause finding for customer return on ATE ( auto testing equipemnt) To be the technical owner for the test progrm Control the change on test program and test hardward using a structured process. Your team Business line AAES - Radar and ADAS system is leading in mixed signal processors for car radar applications. We lead the industry in state of the art solutions, using advanced CMOS technologies. You will be working in an international Test Engineering team with close connections to other disciplines and manufacturing sites. At BL AAES Test Engineering is involved in new product introduction projects from the very beginning, having strong focus on the bring-up phase until product release. Your profile The role requires core competences in Test Engineering. In addition, the Test Engineer needs to act as catalyst for neighboring competences, such as IC Design, Product Engineering and IC Validation. Strong communication skills, sense of ownership, curiosity beyond boundaries, team oriented but able to work independently are personal characteristics key to success in this role. You have: Bachelors or Masters degree in Electrical Engineering or equivalent Interested in programming ( C, Java, VB) Basic understanding of digital/analog/ RF cuntion block and electronic circuits Basic knowledge on test methdology for semiconductor industrial Basic data analysis skills Fluent in English, both spoken and written Proactive working attitude Willing to participate in overseas training Capable to handle new challenge Furthermore, you are: Experience with ATE test platforms Good understanding of VLSI test techniques Basic knowledge of industrial flow Our offer Business Line AAESs Test engineering team works in close collaboration with peer teams. This broadens the exposure to opportunities to learn. It also gives the possibility to develop deep core competences in specialized areas and deploy the benefits widely. Finally, the position offers excellent growth opportunities and opens the path to longer term career paths within the company. There is a lot of room for innovative ideas and you will be supported to have a continuous focus on development. More information about NXP in Greater China... #LI-7743

【Why This Role?】 Drive Core Technology: Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness. Lead Mass Production Breakthroughs: Take ownership of the critical path from New Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM). Cross-Domain Collaboration: Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below). 【Key Responsibilities】 Process Integration Leadership: Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks. Deep Characterization & Analysis: Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions. Yield Enhancement & Stability: Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency. Foundry Management: Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer. 【Required Qualifications】 Education: Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field. Experience: 10 years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (eFlash, RRAM, MRAM). Data Insight: Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics. 【Preferred Skills】 Process Transfer Expertise: Successful track record in Copy-Smart process migration, ensuring process consistency and rapid yield ramp-up during technology transfer. BCD Process Expertise: Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization. Advanced Node Experience: Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond. Design Collaboration: Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design. 【Soft Qualities】 Analytical Thinking: Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies. Proactive Ownership: Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks. Effective Communication: Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams. More information about NXP in Greater China... #LI-7743

Tape Out Engineer Job Description Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key ResponsibilitiesCoordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. Ensure all deliverables conform to foundry requirements. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. QualificationsBachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products. More information about NXP in Greater China... #LI-7743

• 職責：外部晶圓代工廠合作、Logic/RF 技術節點導入與製程移轉、良率與效能達成 • 領域：晶圓代工 / Logic/RF 元件 • 技能：Foundry 工程、Logic/RF 元件、NTI 技術導入、製程移轉 • 亮點：NXP APAC 代工技術核心職位，負責先進 Logic/RF 技術節點的代工廠合作與導入

• 職責：FDC/ADC 模型設定、監控邏輯閾值管理、Die Bond 製程改善專案執行 • 領域：半導體封裝 / Die Bond 製程 • 技能：FDC/ADC、Die Bond、製程監控、良率改善 • 亮點：NXP Die Bond 製程資深工程師，負責製程監控精確性與生產效率改善

• 職責：NXP ATE 測試硬體設計總監，領導全球工程團隊，制定測試硬體技術藍圖，管控 load board/probe card 品質與 HVM 就緒 • 領域：半導體 ATE 測試硬體 / 工程管理 • 技能：硬體設計領導、測試硬體策略、FTR 矽驗證、HVM 就緒、風險管理 • 亮點：統籌全球 ATE 測試硬體工程，確保 NXP 產品首次矽驗證成功率

• 職責：NXP APAC 晶圓代工運營資深首席工程師，主導製程整合決策，管理供應商關係，支援業務需求 • 領域：半導體前段製程 / APAC 晶圓代工運營 • 技能：製程整合、晶圓廠管理、資源規劃、供應商關係、技術判斷與決策 • 亮點：10 年以上資深職缺，作為 APAC 製程整合主要決策者，平衡技術與商業動態

• 職責：NXP 供應鏈規劃師，管理客戶訂單、預測與安全庫存補充，執行 PO 管理、供應偏差控制與退貨處理 • 領域：半導體供應鏈 / 生產規劃 • 技能：需求規劃、PO 管理、供應偏差管控、庫存管理、跨部門協作 • 亮點：作為供需橋梁，與業務/製造/物流協同，確保 NXP 客戶供貨承諾達成

• 職責：NXP 測試整合工程師（新鮮人），負責測試工具整合、IC 測試數據審查、新品導入追蹤與升級管理 • 領域：半導體測試整合 / IC 測試工程 • 技能：測試工具整合、IC 測試數據分析、NPI 追蹤、升級管理、ECO 流程 • 亮點：新鮮人可申請（2 年內），參與 NXP 產品從開發到量產轉移的關鍵測試整合工作

• 職責：NXP 供應鏈工廠規劃實習生（半年期），協助供應鏈規劃作業，學習生產排程與工廠計畫管理 • 領域：半導體供應鏈 / 工廠規劃 • 技能：供應鏈管理、生產規劃、英語溝通、商業分析 • 亮點：2026 下半年半年期實習（7-12 月），每週 3 天以上，進入 NXP 全球供應鏈核心

• 職責：NXP 業務實習生，協助業務團隊客戶拜訪、銷售支援與市場分析 • 領域：半導體 / 業務銷售 • 技能：業務支援、客戶溝通、市場分析 • 亮點：進入 NXP 全球業務體系，接觸頂尖半導體客戶與銷售策略

• 職責：NXP 倉儲管理員，負責倉庫物料管理、庫存控制與出入庫作業 • 領域：半導體 / 倉儲物料管理 • 技能：倉儲管理、庫存控制、物料出入庫作業 • 亮點：加入 NXP 台灣供應鏈團隊，維護倉儲物料精準管控

• 職責：NXP 設備工程師（新鮮人），負責半導體製程設備維護、參數設定與製程知識學習 • 領域：半導體製造設備工程 • 技能：設備維護、問題解決、團隊合作、製程設備知識、英語溝通 • 亮點：新鮮人友善職缺，在 NXP 全球半導體環境中建立設備工程師基礎能力

• 職責：NXP 產品工程師（新鮮人），執行失效分析、協同量產準備，排除測試問題，推動良率與成本改善 • 領域：半導體產品工程 / 測試良率 • 技能：失效分析、良率分析、Python/C/MATLAB、AI/ML 加分、半導體基礎 • 亮點：結構化入職培訓與資深工程師 mentorship，快速成長為全球化產品工程師

• 職責：NXP 品質技術員，負責半導體產品品質檢驗、數據記錄與品質標準維護 • 領域：半導體製造 / 品質管控 • 技能：品質檢驗、數據記錄、品質標準執行 • 亮點：直接支援 NXP 生產線品質把關，確保產品符合出貨規格