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Bachelor
Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
Role Overview
We are seeking an IC Package Design Engineer to support the planning, coordination, and execution of IC package design activities across complex semiconductor product development programs.
This role emphasizes program execution, cross‑functional coordination, and delivery predictability, supporting package design efforts from early feasibility and design planning through tapeout and manufacturing readiness. The engineer will collaborate closely with package designers, integration engineers, SI/PI teams, manufacturing partners, and operations teams to ensure alignment, issue tracking, and timely delivery of package milestones.
EDA tools and automation are used primarily as enablers of execution, while the core focus of this role is on driving clarity, managing dependencies, and reducing execution risk.
Key Responsibilities
Program Execution & Coordination (Primary Focus)
Cross‑Functional & External Engagement
Design, EDA & Process Enablement (Supporting / Enabling Role)
Use existing package design flows, EDA tools, reference methodologies, and execution checklists to support program execution.
Draft, document, and maintain process flows that clearly define execution steps, handoffs, inputs, and outputs across the package design lifecycle.
Develop clear, structured documentation describing:Package design and execution workflows
Design release and handoff steps
Readiness checks and acceptance criteria
Common issues, failure modes, and escalation paths
Translate complex technical activities into repeatable, well‑defined process steps that can be consistently followed across teams.
Support EDA and design‑flow issue triage, coordinating with subject‑matter experts and tool owners as needed.
Apply light scripting or automation where helpful to support reporting, consistency checks, or process enforcement.
Capture lessons learned and best practices and incorporate them into updated process documentation and workflows.
Required Skills & Experience
Program & Execution Skills (Core)
Experience supporting complex, cross‑functional engineering programs.
Strong organizational skills with the ability to manage multiple workstreams in parallel.
Experience using project / program management tools, including:Execution dashboards
Milestone and dependency trackers
Gantt charts or schedule views
Action‑item and risk tracking tools
Comfortable driving execution in matrixed organizations without direct reporting authority.
Strong written and verbal communication skills.
Technical Context (Enabling)
Familiarity with IC package development lifecycles and execution flows.
Working knowledge of IC package design, layout, integration, or manufacturing concepts.
Exposure to package design or EDA tools such as:Cadence APD / SIP
Cadence Innovus / Virtuoso
Mentor Xpedition
Valor and RAVEL
Scripting or automation experience (e.g., Python, TCL) is a plus but not required.
Minimum Qualifications:
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