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Bachelor
Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with IC, Package and PBC designers to find ways to optimize the overall System performance. The candidate’s responsibility is working with substrate designers to make sure all system level constraints are met prior to the package Tape-out. The candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as PCIe, UFS, USB, MIPI, LPDDR, etc, and also with PCB designers to assess the impact of Ball assignment to the system level performance. This position offers the opportunity to work across multiple organizations such as PHY team, PCB team and PSIG and providing timely feedback and updating design guideline to the team is essential.
The responsibilities will include but not be limited to the following:
Minimum Qualifications:
Preferred Qualifications:
Minimum Qualifications:
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