NXP
EQUIPMENT ENGINEER
高雄正職不限製造與生產發布：2026-05-14
職缺摘要
職責設計打線相關零件與工具；合理化機台預防保養頻率；評估新打線機台
領域半導體封裝打線設備
技能Wire bond machine、preventive maintenance、spare parts management、machine overhaul、production system
亮點NXP 為全球車用半導體領導者，此職位負責打線設備的設計與維護，具備設備翻修與系統建置機會
學歷要求
None
職缺描述
Equipment engineer with ME/EE background to fulfill tasks below.
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Design wire bond related parts / tool
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Rationalize machine preventive maintain frequency
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Cooperate with process engineer to evaluate new wire bond machine
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Training line repair technician
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Spare parts lifetime evaluation and safety stock management
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Standardize machine repair procedure
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Capability to overhaul wire bond machine
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Cooperate with IT for production system build up and sustain
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