NXP
EQUIPMENT ENGINEER
高雄正職3-5年製造與生產發布：2026-05-14
職缺摘要
•職責：設計導線接合相關零件、機台維護、評估新機台、訓練維修人員
•領域：Wire Bond 製程、半導體後道封裝製造設備工程
•技能：Wire Bond 機台、機械工程、電機工程、預防性維護、機台改善、安全庫存管理、系統整合
•亮點：適合具機械或電機背景、專注導線接合設備全生命週期管理的工程師
技術需求
Wire Bond機台設計預防性維護機台改善安全庫存管理系統整合機械工程電機工程
學歷要求
Bachelor
職缺描述
Equipment engineer with ME/EE background to fulfill tasks below.
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Design wire bond related parts / tool
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Rationalize machine preventive maintain frequency
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Cooperate with process engineer to evaluate new wire bond machine
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Training line repair technician
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Spare parts lifetime evaluation and safety stock management
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Standardize machine repair procedure
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Capability to overhaul wire bond machine
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Cooperate with IT for production system build up and sustain
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