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Qualcomm
Master
Company:
Qualcomm Semiconductor Limited
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
Job Overview
This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomm's current/future chipsets using FEA expertise, working closely with design, new product introduction (NPI) and Chip-Package Interaction (CPI) teams by providing mechanical simulation support for current HVM and advanced packaging technologies. This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench), maintain APDL macros/workflows, establish FEA methodologies/BKM for test correlation, material characterization, and performing stress/mechanical analysis for IC package designs and failure prediction. Job responsibilities include but are not limited to: Warpage/Stress analysis, Solder joint reliability (SJR) prediction, package assembly process simulation, and chip package interaction (CPI) analysis. The candidate must be capable of utilizing advanced Finite Element Analysis (FEA) techniques (sub-modeling approach, contact analysis, non-linear analysis), and test procedures for material characterization/testing. Candidate should also understand the fundamentals of silicon, package, and board level interconnect technologies. The candidate is expected to have strong communications, project focus and execution skills.
All Qualcomm employees are expected to actively support diversity in their teams, and in the Company.
Minimum Qualifications
Preferred Qualifications
Minimum Qualifications:
Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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If you would like more information about this role, please contact Qualcomm Careers.