載入中…
Qualcomm
Bachelor
Company:
Qualcomm Semiconductor Limited
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
The engineer will be a key member of the Process Package Integration and bumping process team, driving technology development and new product introduction (NPI) with primary ownership of wafer bumping (Far-BEOL) process integration, qualification, and high-volume readiness across multiple silicon technology nodes, foundries, bumping lines, and assembly houses (OSATs). Key responsibilities include defining bumping process flows (passivation/UBM/RDL/bump), establishing process windows and controls, leading DOE-based optimization, and partnering with suppliers to improve yield, reliability, and cost. The role works closely with foundry FBEOL teams, bumping/assembly partners, and internal package design, process, quality, test, and product development teams to deliver robust bumping solutions enabling advanced packaging (flip-chip, RDL/fan-out, and 2.5D/3DIC). The candidate will also lead bumping house/line bring-up, qualification, and ongoing performance management to expand capacity and ensure multi-source readiness.
Skill/Knowledge:
Expertise in Far-BEOL bumping process modules and integration, including passivation openings, UBM, RDL (as applicable), solder/Cu pillar bump formation, and associated materials/equipment.
Deep knowledge of flip-chip bump design intent and assembly interactions (bump metallurgy, pitch scaling, coplanarity, warpage interactions), and wafer-level packaging (RDL) / fan-out process considerations impacting bumping.
Strong technical skills in bumping process/material/equipment characterization (metrology and inline controls), failure analysis, DOE design, statistical data analysis, and FMEA to drive yield and reliability improvements.
Experience leading bumping process qualification and production release activities (process window definition, control plans/SPC, GR&R, and risk mitigation) for NPI and high-volume manufacturing.
Proven track record enabling package development through robust bumping solutions for flip-chip, RDL/fan-out RDL, and advanced packaging technologies (2.5D/3DIC).
Expertise in manufacturing execution for Far-BEOL bump structures and bump line operations, including new bumping line bring-up, tooling/equipment qualification, and production ramp (HVM readiness).
Hands-on experience in project leadership and supplier management for external bumping houses/OSATs, including KPI definition, yield excursions containment, and continuous improvement programs.
Experienced interfacing with foundries and bumping houses on process integration, change control, line qualification, and multi-source/capacity expansion.
Understanding of heterogeneous integration (2.5D/3DIC) packaging flows and how bumping/interconnect schemes (micro-bumps, fine-pitch RDL) impact downstream assembly and reliability.
Ability to design and drive novel test vehicles/structures for bump/RDL process characterization and process-package interaction (reliability, electromigration, mechanical integrity).
Experience with chip and substrate design tools such as Calibre, Virtuoso, CAD, SiP, and GDS.
Understanding of chip-top physical design flow and communication with package design teams.
Minimum of 8–10 years hands-on experience in silicon interconnect process, bumping and/or RDL process, new technology qualification and production.
Additional Skills
Good analytical and project management skills.
Excellent capability of innovation and creativity.
Highly motivated and committed to success of the individual and the team.
Superior interpersonal communication skills. Publish technical reports.
Able to work flexible hours. Occasional domestic/international travels needed.
Education Requirements: M.S. or Ph.D. in Materials Science, Mechanical engineering, chemical engineering or equivalent.
Minimum Qualifications:
Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
If you would like more information about this role, please contact Qualcomm Careers.