NXP

Principal Process Integration Engineer

新竹正職5+年製程工程發布：2026-05-08

職缺摘要

•職責：主導 CMOS 和 NVM 製程流程設計與最佳化、執行統計分析與物理失效分析、主持跨功能良率改善計畫、與國際晶圓廠協作管理技術團隊

•領域：CMOS 邏輯製程、Non-Volatile Memory（eFlash、RRAM、MRAM）、先進製程節點（28nm 以下）、BCD 製程、PMIC 最佳化

•技能：製程整合、物理失效分析（PFA）、統計分析、JMP、Python、Spotfire、良率管理、製程轉移、Copy-Smart 製程遷移、記憶體架構、NVM 操作原理

•亮點：適合具 10 年半導體業經驗、專精 CMOS 或 NVM 技術、有先進製程節點量產經驗的資深工程師

CMOS製程NVMeFlashRRAMMRAMBCD製程PMIC

職缺描述

【Why This Role?】

Drive Core Technology: Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness.
Lead Mass Production Breakthroughs: Take ownership of the critical path from New Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM).
Cross-Domain Collaboration: Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below).

【Key Responsibilities】

Process Integration Leadership: Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks.
Deep Characterization & Analysis: Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions.
Yield Enhancement & Stability: Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency.
Foundry Management: Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer.

【Required Qualifications】

Education: Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field.
Experience: 10+ years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (eFlash, RRAM, MRAM).
Data Insight: Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics.

【Preferred Skills】

Process Transfer Expertise: Successful track record in "Copy-Smart" process migration, ensuring process consistency and rapid yield ramp-up during technology transfer.
BCD Process Expertise: Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization.
Advanced Node Experience: Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond.
Design Collaboration: Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design.

【Soft Qualities】

Analytical Thinking: Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies.
Proactive Ownership: Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks.
Effective Communication: Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams.

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