
External Manufacturing Engineer
職缺摘要
技術需求
學歷要求
Bachelor
職缺描述
Job Summary:
Project leader for Resilience, Subcon Consolidation, Dual Source Qual, low cost project & responsible for strategic program portfolio in mass production environment. Leading cross site-functional core team and accountable for project deliverables, through Change Control Board (CAB) and IATF 16949 requirements.
Related to Assembly Test Backend & WLCSP processes.
Requirements:
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Bachelor's Degree in Engineering or equivalent technical background.
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Minimum 5 & best with 8 years of experience in semiconductor IC manufacturing environment, with hands on exposure from Wafer Bump Process, Assembly/ Test process & Packaging experiences.
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Knowledge and track records of cross site-functional program management, team leadership, technical writing with presentation, self driven and discipline.
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Certified PMP will be an added advantage.