載入中…
Bachelor
WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
THE ROLE:
This Position is for Director, EMO_BackEnd Engineering stationed in Hsinchu, Taiwan.
The Ideal Candidate will have a balanced mix of strong technical knowledge as well as Leadership experience in Substrates & PCB MFG & Advanced Packaging Functions. You will be responsible for driving key performance metrics related to NPI projects, HVM Sustaining, supplier site HVM readiness, process optimization, and improvements in areas like Yield and CIP’s apart from BCP.
THE PERSON:
The successful candidates must be strong team player with a commitment to lead & drive for solutions and an aptitude to thrive & ability to work in a fast-paced multi-tasking environment and meet deadlines. He or she would have excellent cross functional project management skills, data analysis skills to effectively manage substrate/pcb suppliers, conflict management skills, strong interpersonal skills, people management skill on career planning & development, day to day & regular coaching & monitoring. Proficiency in English (speaking, writing, and presenting) is essential.
KEY RESPONSIBILITIES:
PREFERRED EXPERIENCE:
Minimum 20 years+ experience in IC Substrate/PCB Engineering & Operations or with Fabless companies (Managing substrate suppliers)..
Experience in Co-working/managing horizontally across multiple internal functional organizations.
Technical expertise in FC-BGA, LGA, Adv PKG Substrates & PCB Manufacturing /Development and related Interactions.
Experience in substrate/PCB development, from NPI to HVM, is a plus.
Team player with a commitment to meeting deadlines/Lead & Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment.
Creative, Self-Driven, highly motivated individual with demonstrated ability to independently manage complex engineering tasks.
Strong interpersonal communication, analytical, project management, task & time management and excellent executive presentation & communication skills.
Strong Statistical knowledge Familiar with failure analysis tool, package reliability knowledge and Industry standards is essential
People management skills.
Good English speaking, Executive communication, and Presentation skills.
Ability and Willingness to travel internationally is required
ACADEMIC CREDENTIALS:
LOCATION:
Hsinchu,Taiwan
_Benefits offered are described:_AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
__
This posting is for an existing vacancy.