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NXP
Bachelor
Job DescriptionDescription: The APAC Central Competence Team partners with external foundries to ensure robust chip supply and technology enablement for NXP’s business lines. This role focuses on driving advanced node technology ramp-up and transfer, with a strong emphasis logic/RF devices. The primary responsibility of this role is to lead and support new technology introduction (NTI) and process transfers involving logic/RF technologies, ensuring manufacturability, yield, and performance targets are met.
The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures
Requirements / preferences:
- Bachelor’s or Master’s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .
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