NXP

Sr. Die Bond Process Engineer

高雄正職3-5年製程工程發布：2026-04-30

職缺摘要

•職責：FDC/ADC 模型建置與準確性驗證、監控邏輯與門檻值配置、跨部門協作推動專案執行

•領域：半導體製造 - Die Attach 製程控制與良率管理、FDC/ADC 系統應用

•技能：FDC、ADC、SPC、Cp/Cpk、GR&R、MSA、8D、5 Why、製程控制、良率分析、缺陷預測、製程自動化、root cause analysis、英文溝通

•亮點：專為 Die Attach 製程工程師設計，強調 FDC/ADC 實務經驗與跨團隊協作的資深職位

FDCADCSPCCp/CpkGR&RMSA8D5 Why

職缺描述

Ensure high-quality and accurate implementation Responsible for FDC/ADC model setup based on solid process knowledge and failure analysis experience, ensuring model accuracy and minimizing rework.
Manage and reduce configuration risks Configure monitoring logic, thresholds, and rules to effectively distinguish true signals from noise, reducing false alarms and missed detections that may impact production.
Drive efficient project execution Ramp up on systems and processes, minimizing trial-and-error to ensure timely and effective implementation of FDC/ADC projects.
Collaborate across cross-functional teams Work closely with Process, Equipment, Manufacturing, and IT teams to align objectives, communicate technical insights, and drive decisions efficiently.
Support yield improvement and operational performance Leverage monitoring systems to enable actionable insights that contribute to quality improvement, yield enhancement, and manufacturing efficiency.
Ensure project continuity and long-term ownership Demonstrate strong role clarity and accountability, supporting stable system operation, continuous improvement, and sustained project ownership.

Requirements:

Basic Qualifications:

At least 2 years of working experience in semiconductor manufacturing, preferably as a Die Attach Process Engineer.
Master’s degree or above in engineering-related disciplines, such as Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering.

Technical and Analytical Skills:

Solid knowledge of process control, yield analysis, defect reduction, and continuous improvement methodologies.
Candidates with a statistics-related background are preferred, with the ability to apply data analysis techniques to process monitoring and improvement (e.g. SPC, Cp/Cpk, GR&R, MSA).
Hands-on experience with FDC (Fault Detection & Classification) and ADC (Automatic Defect Classification) applications, capable of utilizing process and equipment data for abnormal detection, trend monitoring, and early warning.
Experience in process automation applications, able to support system- or equipment-level automation projects to enhance process control and reduce manual operation risks.

Quality and Customer Interface Experience:

Experience in customer complaint handling and root cause analysis, familiar with structured problem-solving methodologies such as 8D, 5 Why.
Ability to work effectively with cross-functional teams (Process, Quality, Equipment, and Suppliers) to drive corrective and preventive actions.

Communication Skills:

Good written and verbal English communication skills, capable of effective interaction with customers, suppliers, and internal teams.
English proficiency equivalent to TOEIC 600 or above.

Systems and Manufacturing Knowledge

Ability to leverage system and automation data for process tracking, lot history review, abnormal analysis, and continuous improvement activities.

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