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Bachelor
Lead Mechanical and thermal Development: Deliver innovative mechanical and thermal architecture and designs for compute & AI server and cooling systems, integrating thermal, structural, and electrical constraints with a deep understanding of server architecture and adjacencies. End-to-End System Design Ownership: Lead system-level design from concept through production, including architectural trade-offs, technical decision-making, and alignment across chip, tray, rack, and datacenter interfaces. Liquid Cooling Architecture Leadership: Architect and drive the design and development of complex liquid cooling solutions at the server, rack, and datacenter levels, including liquid-to-air heat exchangers, CDUs, manifolds, and piping. Fluid Distribution & Thermal Implementation: Own the mechanical and thermal implementation of fluid distribution systems within server racks, including: Design for Manufacturing & Reliability: Ensure manufacturability, cost-efficiency, and long-term reliability through material selection, tolerance control, supplier engagement, and understanding of tooling and manufacturing processes. OR Bachelor's degree in Mechanical Engineering, or related field AND 6+ years related technical engineering experience OR Master's degree in Mechanical Engineering, or related field AND 4+ years related technical engineering experience OR Doctorate degree in Mechanical Engineering, or related field AND 3+ years related technical engineering experience OR equivalent experience. Proficiency in CAD software understanding of mechanical design principles, GD&T analysis, mechanical vibration and shock, material compatibility, tooling, manufacturing processes, validation, and packaging. Experience with prototyping, tooling, and high-volume manufacturing of electronic enclosures. Experience leading complex design programs, crossfunctional design reviews and architectural decisions. Experience with cabling and networking interconnect technology. Experience with development of specifications, interface control documents, and managing design requirements. Hands-on experience with the end-to-end design of liquid cooling subsystems, such as QD, Cold Plate, Manifold, RPU and CDU. Hands-on experience with FloTHERM, FLOEFD, Ansys, Icepak, Macroflow or equivalent CFD analysis software. 5 + years of thermal and mechanical design principles, fluid dynamics, pumps and compressors, mechanical vibration and shock, valve and manifold design, material compatibility, manufacturing processes, and validation. 10 years of experience in the electronics industry specifically related to high-density, liquid cooled compute systems. 15+ years of industry experience in the electronics industry with server development background. Proficient analytical and problem-solving skills, with the ability to identify and resolve mechanical design issues and optimize system performance. Advanced knowledge of analytical tools/processes for heat transfer, fluid flow, material science, and structural analysis. Ability to generate and analyze architectural solutions, including directional cost analysis, feasibility and engineering degree of difficulty. Experience in tolerance analysis and the production part approval (PPAP) process.