Coherent
Package Design and Assembly Engineer
其他地區正職不限光學/量測發布：2026-03-26
職缺摘要
•職責：光學模組（VCSEL、邊射雷射、光學、驅動器）設計開發、製造轉移和代工支援
•領域：光學模組封裝設計、VCSEL 和邊射雷射組裝製程、RF/熱/機械/光學整合設計
•技能：VCSEL 設計、邊射雷射（EEL）、光學設計、RF 設計、熱管理、機械設計、組裝製程、代工合作管理
•亮點：涵蓋光學晶片到模組整合的全端設計與製造支援經驗
技術需求
VCSELEdge Emitting Lasers (EEL)RF designThermal designMechanical designOptical designAssembly processesContract ManufacturingPackage designOptical modules
學歷要求
None
職缺描述
The Package Design and Assembly Engineer is responsible for developing Optical Modules including VCSEL, Edge Emitting Lasers (EELs), Optics, and drivers, and transferring/supporting the Assembly and Test processes to the Contract Manufacturing Partners. The candidate should have good knowledge of advanced assembly processes considering RF, thermal, mechanical and optical designs with the goal to identify the best manufacturing methods aa well as the assembly partners