Applications Engineering, Staff Engineer_3DIC

We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

You are a passionate engineering professional with extensive expertise in advanced semiconductor design methodologies, particularly in the areas of 3DIC and multi-die system integration. You have a strong academic background, likely holding a Bachelor’s, Master’s, or Ph.D. in Electrical or Computer Engineering, complemented by at least 9 years of industry experience. Your technical proficiency spans physical design flows, signoff analysis, and CAD automation, and you are comfortable working hands-on with industry-leading EDA tools such as ICC2, Fusion Compiler, and StarRC. You thrive on solving complex customer challenges and are energized by engaging directly with customers to enable their success with cutting-edge solutions.

Your experience extends beyond technical depth—you are a natural collaborator who excels in cross-functional, multicultural environments, and you communicate technical concepts with clarity and impact. You are excited by the opportunity to influence product direction and methodology development, and you are ready to lead technical initiatives that shape the next generation of silicon. You possess a growth mindset, embrace new technologies, and are committed to continuous learning. Your customer-first approach, adaptability, and drive for excellence make you a trusted advisor and role model within the team.

What You’ll Be Doing:

• Lead deployment, release, and ongoing support of advanced Synopsys EDA solutions focused on 3DIC and advanced packaging technologies for key customers in Taiwan and the broader region.
• Enable customer designs by partnering with internal R&D, Product Engineering, and Applications Engineering teams to develop robust methodologies addressing complex SoC, chiplet, and multi-die system challenges.
• Act as a trusted technical advisor, guiding customers through design optimization, signoff, and adoption of Synopsys’ advanced 3DIC/IC packaging capabilities.
• Collaborate with end users and engineering teams to specify, develop, validate, and maintain EDA tool flows tailored for advanced semiconductor designs.
• Drive the collection, refinement, and documentation of flow requirements based on customer needs, field feedback, and emerging tool capabilities.
• Define and deliver new or enhanced cross-product flows, methodologies, and tool features for 3DIC and advanced physical design, promoting best-practice sharing across teams.
• Build and maintain strong working relationships with Product R&D, AE, end users, and Product Management, influencing product direction through structured feedback and real-world use cases.

The Impact You Will Have:

• Accelerate customer success and innovation in 3DIC and advanced packaging by ensuring seamless adoption and optimal use of Synopsys EDA solutions.
• Shape product direction and tool evolution by channeling customer feedback, technical insight, and field experience into R&D and product management.
• Advance industry best practices in chiplet and multi-die SoC design methodologies, positioning Synopsys as the partner of choice for leading-edge design teams.
• Enhance cross-team collaboration and knowledge sharing, helping Synopsys scale the impact of its technology across multiple product lines and customer segments.
• Drive continuous improvement of design flows and methodologies, improving efficiency, quality, and performance for Synopsys customers worldwide.
• Foster long-term customer relationships, building trust and loyalty through technical leadership, reliability, and exceptional support.

What You’ll Need:

• Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Computer Engineering, or a related field, with a minimum of 9 years’ relevant industry experience.
• Strong proficiency in at least one physical design and implementation tool or methodology (e.g., ICC2, Fusion Compiler), including place-and-route, SI/PI analysis, EM/IR analysis, thermal analysis, STA signoff, and DRC/LVS.
• Expertise in scripting for CAD flow development and automation; proficiency in Tcl is required, with Perl and/or Python highly desirable.
• Hands-on experience with 3DIC or multi-die package implementation, especially in SoC or system-level integration roles.
• Familiarity with advanced analysis tools and methodologies (e.g., RLC extraction with StarRC, analog circuit simulation, voltage drop and power integrity analysis, thermal analysis) is a strong plus.

Who You Are:

• Collaborative team player able to work effectively in global, multi-cultural environments.
• Strong communicator with the ability to explain complex technical topics to diverse audiences.
• Customer-focused, with a commitment to delivering high-quality solutions and support.
• Proactive, adaptable, and resilient, with strong organizational and multi-tasking skills.
• Natural problem solver, eager to drive innovation and continuous improvement.

The Team You’ll Be A Part Of:

You will join a high-performing Applications Engineering team at the forefront of enabling Synopsys’ most advanced customers. The team is diverse, collaborative, and deeply committed to technical excellence, customer success, and innovation in 3DIC and advanced packaging. You’ll work alongside leading experts in EDA, R&D, and product management, sharing knowledge and solving critical challenges for some of the world’s most innovative semiconductor companies.

Rewards and Benefits:

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.

#TPG