職缺青蛙

• 職責：管理先進基板封裝供應商合作、推動 EMIB-T 次世代封裝技術部署、新產能認證 • 領域：先進封裝基板 / Intel 晶圓廠 • 技能：先進基板封裝、EMIB-T、供應商管理、異質晶片架構、新產能認證 • 亮點：Intel APTD 的 Senior 基板計畫管理師，推動 EMIB-T 等次世代 AI 晶片封裝技術全球部署

• 職責：主導 Intel 基板供應鏈規劃分析、協調跨 BU 供應需求、優化排程/預測/庫存策略 • 領域：基板供應鏈規劃 / 半導體 • 技能：供應鏈規劃、供需分析、庫存策略、產能規劃、跨功能協作 • 亮點：Intel 基板供應鏈規劃分析師，直接影響 Intel 客戶交期達成與供應鏈效率

• 職責：Intel Ethernet 產品軟體使能與優化、PCIe 介連與以太網路整合除錯、韌體除錯與驅動使能 • 領域：Ethernet 軟體優化 / 網路系統 • 技能：Intel Ethernet、PCIe、網路驅動、韌體除錯、x86 架構 • 亮點：Intel Senior 以太網路軟體工程師，深入除錯 Ethernet NIC 與 x86 平台的複雜整合問題

• 職責：開發 Client 平台 BIOS 與參考程式碼、支援 Intel CPU/晶片組/平台技術、BIOS 開發工具開發 • 領域：BIOS 工程 / Intel 客戶端平台 • 技能：UEFI BIOS、C 語言、X86 架構、ACPI、Intel 平台技術 • 亮點：Intel BIOS 工程師，支援 Intel CPU/晶片組的 Client 平台 BIOS 開發，適合熟悉 UEFI 的工程師

Job Details: Job Description: Responsible for the overall design and development of systems and solutions that integrate software, firmware, board, and silicon/SoC components for a specific segment with specific focus on customer requirements and implementation limitations throughout the systems lifecycle. May also be responsible for systems architecture and definition, including translating the business opportunity into use cases and developing the product specifications for required hardware and software needed to deliver system requirements. Leads design, analysis, and implementation of component level choices across the integrated systems on performance, features, and cost including technical risk assessment and emphasis on ease of use, reliability, security, availability, maintainability, sustainability, and quality based on system or platform architecture specifications. Defines systems implementation and integration solutions and plans to ensure optimum performance and reliability across hardware and software that comprise the system. Delivers end to end technical solutions to solve customer problems, deploying solutions, executing benchmark tests, and preparing documentation. Collaborates with other teams to analyze next generation requirements and opportunities and may influence and guide research and academic collaboration on systems and solutions, including proof of concept and solutions beyond current industry approaches. Guides and conducts lab experiments of proof of concept innovations and new feature feasibility studies. Simulates real life environments in the lab and analyzes performance of prototypes. Qualifications:Bachelors degree or above in Electrical Engineering, Computer Science, or related field. 5 years of experience with Bluetooth stack, profiles, Controller and RF performance on Windows PCs and Bluetooth products. Hands-on experience in Bluetooth validation, testing, or debugging on Windows or Chrome OS platforms. Strong understanding of Bluetooth Classic and Bluetooth Low Energy protocols, profiles (A2DP, HFP, HID, GATT), and LE Audio technologies. Solid knowledge of Windows OS, driver installation, and log collection (e.g., ETW, WPP, Ellisys, HCI logs). Proven experience in bug triage and debug collaboration with internal driver/firmware teams and external customers. Excellent communication skills in English and Mandarin, and ability to work directly with global OEM partners. Creative mindset and willing to build new ideas with hands on approach.            Job Type:Experienced Hire Shift:Shift 1 (Taiwan) Primary Location: Taiwan, Taipei Additional Locations: Business group:Silicon and Platform Engineering Group (SPE): Deliver breakthrough silicon and platform solutions that deliver industry-leading products today while also defining the next generation of computing experiences. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

• 職責：在 APJ 地區推動 Intel Edge AI 系統的 ISV 夥伴招募與使能、識別高潛力城市/機器人/醫療 ISV • 領域：Edge AI 生態系 / ISV 合作 • 技能：生態系管理、ISV 合作、Edge AI、業務開發、APAC 市場 • 亮點：Intel Sr. Edge 生態系使能顧問，在 APJ 地區打造 Intel Edge AI Systems 的 ISV 夥伴生態系

• 職責：協助開發企業/客戶 AI 解決方案、優化 AI 框架與系統設計、硬體軟體跨功能協作 • 領域：AI 系統解決方案 / Intel • 技能：AI 框架、系統設計、AI 優化、Python、硬體/軟體協作 • 亮點：Intel System Lab AI Solution 碩士實習，直接參與 Intel 的 AI 技術創新解決方案開發

• 職責：提供 Intel AI 數據中心系統架構諮詢、推動平台方案就緒、與生態系夥伴協作 • 領域：數據中心 AI 系統 / 客戶使能 • 技能：AI 系統架構、數據中心、Intel 產品整合、生態系使能、技術諮詢 • 亮點：Intel 數據中心客戶 AI 系統工程師，直接影響 Intel AI 產品在超大規模運算商的部署成功

• 職責：參與跨軟體堆疊系統軟體開發（韌體/驅動/OS/中介軟體）、Intel 平台效能最佳化 • 領域：網路系統軟體 / Intel 平台 • 技能：韌體、驅動程式、OS 整合、中介軟體、平台效能優化 • 亮點：Intel 網路系統軟體實習，參與跨堆疊軟體開發並為 Intel 平台技術探索職涯方向

• 職責：定義基板材料檢測方法論、供應鏈成本/製程/良率研究、新一代基板技術能力定義 • 領域：基板開發與量產 / 先進封裝 • 技能：基板技術、材料檢測、製程控制、良率分析、供應鏈優化 • 亮點：Intel Sr. 基板開發與量產工程師，推動 Intel 下一代先進封裝基板技術能力建立

• 職責：技術使能 Intel 以太網產品（PCIe 互連與乙太網路介面除錯）、客戶問題解決、偵錯工具開發 • 領域：網路系統工程 / Intel 以太網 • 技能：Intel Ethernet、PCIe、網路系統、技術除錯、客戶管理 • 亮點：Intel 以太網路系統工程師，為離散 Ethernet 控制器與整合 SoC 上的 Ethernet IP 提供技術支援

• 職責：建立終端市場晶圓需求模型、深入理解先進製程節點/封裝技術/IP 機會 • 領域：半導體晶圓廠需求策略 • 技能：需求建模、先進製程、晶片封裝、市場洞察、商業策略 • 亮點：Intel Foundry 需求策略師，分析指定終端市場的晶圓需求並提供商業策略建議

• 職責：開發終端市場晶圓需求模型、分析先進製程/封裝技術機會、提供客戶商業策略洞察 • 領域：半導體晶圓廠需求策略 / 市場分析 • 技能：需求建模、先進製程分析、先進封裝、市場策略、半導體市場洞察 • 亮點：Senior 職位，為 Intel Foundry 建立精確的市場需求模型，推動商業策略決策

• 職責：支援矽晶片產品平台除錯、效能分析與驗證覆蓋、測試自動化與驗證基礎建設開發 • 領域：平台除錯 / 矽驗證 • 技能：Python、C/C++、IA 平台、矽驗證、效能分析 • 亮點：Intel 平台除錯實習，適合熟悉 IA 平台的 MS/PhD 學生，直接參與 Intel 矽產品驗證

• 職責：設計執行分析先進半導體製程實驗、確保工程規格符合最先進晶圓廠製程要求 • 領域：先進裝置開發 / 半導體製程 • 技能：半導體製程、先進技術節點、製程實驗設計、無塵室作業、工程規格分析 • 亮點：Intel Foundry 最先進無塵室的先進裝置開發工程師，推動下一代半導體製程研發

• 職責：作為 Intel 台灣晶圓廠客戶的良率介面、跨功能工廠良率分析與恢復行動、OSAT 管理 • 領域：良率工程 / 晶圓廠客戶工程 • 技能：良率分析、晶圓廠製程、OSAT 管理、客戶工程支援、數據驅動改善 • 亮點：Intel Foundry 在台灣的客戶良率工程師，直接支援台灣客戶的良率問題快速解決